A wireless inductance-capacitance sensor suitable for small packaging.
NASA’s Langley Research Center researchers have developed a wireless low-profile sensor that uses a magnetic field response measurement acquisition system to provide power to the sensor and to acquire physical property measurements from it. Unique to this sensor is the shape of the electrical traces that eliminates the need for separate inductance, capacitance, and connection circuitry. This feature gives the sensor a smaller circuit footprint to enable a smaller, flexible, and easy to fabricate sensor package. The shape of the electrical trace can be readily modified to sense different physical properties. Also, arranging multiple low-profile sensors together can permit the wireless data acquisition system to read the responses from all the sensors by powering just one of them.